The revolution of exotic advanced materials in semiconductor, aerospace, and other industries for mechanical demanding applications has resulted in machining challenges in CNC manufacturers. The challenges have become severer in semiconductor parts machining due to high surface integrity demand and the emerging trend of third-generation semiconductor materials like CVD-SiC, SiC wafer. They exhibit much excellent mechanical and chemical strength and show the extreme difficulty in machining. Consequently, subsurface damage and micro-cracks are easily generated due to of cutting force. Tool life Control also plays an essential role in production since continuous machining would lead to fatigue and crash in tools, which affect significantly in quality control.