◆ S-Curve flexible acceleration and deceleration control is adopted to achieve high speed and smooth movement.
◆ Advanced AC servo drive system for all axes.
◆ Dual-arm design increases wafer throughput.
◆ Vacuum and edge-grip end-effector options are available.
◆ Wafer mapping (optional).
Operating Rang of Z Axis
300/350/500 mm
Operating Rang θ Axis
340°
Operating Rang R/L Axis(Arm)
410/515/615mm
Speed of Z
Maximum 400mm/s；Mean Time 1.17 s/350mm
Speed of θ
Maximum 300°/s ; Mean Time1.90s/340°
Speed of R/L Axis(Arm)
Maximum 1090/1340/1675 mm/s; Mean Time 0.7s 385/475/595mm
Power
220VAC,50Hz/60Hz,1PH,11A
Payload Capacity
Below 3 kgf
