◆ The equipment can be connected to OHT and AGV.
◆ Depending on the requirements, the customer can choose vacuum or edge clamps for wafer transfer process.
◆ The internal micro-environmental cleanliness control is verified by CFD analysis. This design ensures internal and external pressure difference to keep the wafer transfer process free from contamination.
◆ Streamlined design maximizes floor space and saves costs
◆ Optimized robot motion trajectory to achieve speedy and stable transmission with shortest path and curve interpolation
◆ Supports 2-4 ports
◆ Optional ultra-high speed wafer aligner for precise and fast wafer centering and orientation by dynamic image algorithm
◆ Complete data records to meet predictive maintenance under Industry 4.0
◆ Customized service, providing discussions for customized specifications.