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Home Product SHUZ TUNG Auto Laser Grooving 3D Profile Measurement
SHUZ TUNG Auto Laser Grooving 3D Profile Measurement

LG-3200

Provided By

SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.

Contact
Introduction

Applications
Semiconductor wafer packaging, testing and other related industries
Semiconductor mid-end process equipment
. For wafers: 8" & 12"

Main functions:
Laser Grooving Profile Measurement Equipment
Measurements can be performed after wafer laser grooving and before Dicing Saw according to customer requirements.
The measured wafers include 8" & 12"
Contains the following measurement items:
. Laser grooving depth measurement
. Laser grooving upper edge width measurement
. Laser grooving bottom width measurement
. Laser grooving offset measurement

Product Features:
◆Automatic measurement before Dicing Saw & after Laser Grooving
◆Fully Auto Load/ Unload/Wafer Mapping integrated design 
◆Automatic measurement for result of Laser Grooving
◆8"" & 12"" Cassette (universal stage designed)
◆8""/12""  Cassette Load port switching without the need of tools
◆Can measure any point on 8""/12"" wafer  
◆Programmatically for single wafer to be set any 1~99 measuring points.
◆Wafer positioning repeatability X, Y Axis :±5 um. 
◆Automatic Horizontal Alignment θ:± 0.01 degrees (based on Laser Grooving)
◆Auto Focus repeatability Z-axis:±5 um

 

Module

Description

Cassette

8"/12"  Cassette Load port product switching time <60 sec.
8"/12"  Cassette Load port switching without the need of tools

Wafer Type

1. Use for Wafer Thk. 800um~100 um,  
2. Use for Wafer weight. 
1Kg,  
    (The weight include wafer ring)
3. Wafer Thk measurement repeatability accuracy±1um
4. Detectable when difference between actual loading Wafer Thk and recipe 
±10 um

Mapping

For oblique/position/quantity..etc., and display on the user interface.

Measurement Stage

1. 8"/12" shared Wafer chuck table
2. The upper and lower limits of positive and negative pressure can be set and monitored
3. Can measure any point on 8"/12" wafer and programmatically set 1~99 measuring points on single wafer.
4. Stage Flatness accuracy
± 20um
5. Wafer position repeatability accuracy X, Y Axis :±5 um.
6. Auto horizontal alignment 1. θ:± 0.010 (Based on laser grooing path)
7. Auto Focus repeatability accuracy Z Axis:±5 um

Automatic measurement
& analysis items

1. Laser width
2. Laser depth
3. Laser Bottom width
4. Laser edge to seal ring
5. Laser shift
6. Time for Measuring 8 points on 1 wafer 
30min

Connectivity

1. Online:  SECS /GEM, recipe auto dowmload
     (Lot ID, Device name,Wafer Size /Thk, etc.)
2. Offline: recipe manual setting (local machine)

Measuring Time

1. Time for measure 1 point on 1 Wafer (base on measuring time for 1 point = 60sec), including load/unload time.
    Tack Time
  210 sec
2. Time for measure 8 point on 1 Wafer  (base on measuring time for 1 point = 60sec), including load/unload time.
    Tack Time
  15 min