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Home Product Hortech Laser micro-etching machine for patterning on thick films
Hortech Laser micro-etching machine for patterning on thick films

Customized

Provided By

HORTECH COMPANY

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Introduction

This laser micro-etching machine is designed for pattern production on substrates made of thick films. The dust generated in the process of laser micro-etching on thick films tends to result in low yield rates because it causes defection and failure. This patented laser machine solves the above problem by finishing the surface of thick films that are hung upside-down. The dust falls off, so it does not damage the surface. Vacuum cleaning is employed at the bottom simultaneously. Subsequent cleaning is not required. Hortech integrates the high-precision, upside-down motion control module with the optical focus system to develop this laser machine. Precision laser finishing is employed when the machine is undertaking upside-down motion control. The dust is removed by the negative pressure. This process enables stable high-volume production with high yield rates.

  • Dust removal by the upside-down gravity
  • Vacuum cleaning from top to bottom
  • Laser micro-etching with optical focus
  • Dust prevention by positive pressure
The width of laser micro-etching is smaller than 20um on films at 4-12um
The collimation degree of the laser line <+/-2um
The turning R angle of the laser is <20um according to the client’s request
The positioning accuracy of the laser is <+/-5um at 500x500mm
The required laser sources include: 1030-1070, 515-532, 343-355, 257-258nm