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GPM Wafer AOI

GSVW-0300

Bumping Patterned Wafer D,icing Frame CIS
Provided By

GALLANT PRECISION MACHINING CO., LTD

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Introduction

High accuracy 2D surface defect AOI
Fastest review image capture system(up to 14 pics/sec)
AI-auto defect classification

Description Specifications

Surface defect、probe mark, RDL, bump, pillar and metrology

4”~12”, ~600mm x600mm
Patterned Wafer/ Dicing Frame
Bumping
CIS
WLP
FO
FI
PLP
μ-LED
μ-LED Chip on Panel
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