Applications: Semiconductor wafer manufacturing, packaging, testing and related industries Automated handling and packaging inside/outside the factory Uses: 8"" & 12"" wafer shipment and inter-fab transfer (including Reel/HWS/TRAY packaging and shipping) Applicable wafer shippers: FOUP/FOSB(12""); Reel/Jedec Tray/HWS/POD (8"") Types of packaging bags: aluminum bags, antistatic bags, transparent bags Main functions: FOUP/FOSB Automatic Packaging Machine Wafer shippers automatic packaging machine (FOUP, FOSB Auto Packing Machine). Can be customized to put wafer shippers (FOUP, FOSB..etc), Desiccant, Humidity Card, Customer Labels into to customer required bag types (aluminum bag, antistatic bag, transparent bag) and vacuum sealed the packaging. It can save labor costs, reduce safety concerns, improve the quality of wafer packaging, and ensure the airtightness of wafer shippes packaging. Effectively reduces the risk of wafer fragmentation caused by manual operations, and meet the needs of smart production. Label: Attach the customer's label to the bag or FOUP (door housing) Desiccant and HIC card: Place the desiccant and humidity card (HIC) on the FOUP Vacuum heat sealing: vacuum heat sealing after packaging FOUP (can be filled with nitrogen) in bags Folding bag and place tape: fold the bag mouth after heat sealing and fix it with tape.