On the basis of innovative mechanical structure, plentiful tooling system and flexible hybrid guide bush design, SW-II serial can achieve unprecedented rigidity and productivity.

Moving Column Bridge Type Multi-face Machining Center, the MCP series, was designed for machining of large work piece as required by aerospace, automotive, and marine industries.

AWEA's new debut, the AHM series, establishes a new benchmark for cost-effective horizontal machining centers.

PCB 3D topography measurement equipment According to customer needs, the size of surface topography of the PCB board can be measured. Include the following measurement items: Thickness Measurement (Cu) Dimple, Recessed hole depth Trace copper foil (width, space, thickness) Tin pad (diameter, thickness) Via (CD, depth) Surface roughness (Ra,Rz,Rq,Sa,Sz,Sq) Etching (width, space, depth), ..etc.

Applications: Semiconductor wafer manufacturing, packaging, testing and related industries Automated handling and packaging inside/outside the factory Uses: 8"" & 12"" wafer shipment and inter-fab transfer (including Reel/HWS/TRAY packaging and shipping) Applicable wafer shippers: FOUP/FOSB(12""); Reel/Jedec Tray/HWS/POD (8"") Types of packaging bags: aluminum bags, antistatic bags, transparent bags Main functions: FOUP/FOSB Automatic Packaging Machine Wafer shippers automatic packaging machine (FOUP, FOSB Auto Packing Machine). Can be customized to put wafer shippers (FOUP, FOSB..etc), Desiccant, Humidity Card, Customer Labels into to customer required bag types (aluminum bag, antistatic bag, transparent bag) and vacuum sealed the packaging. It can save labor costs, reduce safety concerns, improve the quality of wafer packaging, and ensure the airtightness of wafer shippes packaging. Effectively reduces the risk of wafer fragmentation caused by manual operations, and meet the needs of smart production. Label: Attach the customer's label to the bag or FOUP (door housing) Desiccant and HIC card: Place the desiccant and humidity card (HIC) on the FOUP Vacuum heat sealing: vacuum heat sealing after packaging FOUP (can be filled with nitrogen) in bags Folding bag and place tape: fold the bag mouth after heat sealing and fix it with tape.

Applications: Semiconductor wafer manufacturing, packaging, testing and related industries Automated handling and packaging inside/outside the factory Uses: 8"" & 12"" wafer shipment and inter-fab transfer (including Reel/HWS/TRAY packaging and shipping) Applicable wafer shippers: FOUP/FOSB(12""); Reel/Jedec Tray/HWS/POD (8"") Types of packaging bags: aluminum bags, antistatic bags, transparent bags Main functions: FOUP/FOSB Automatic Packaging Machine Wafer shippers automatic packaging machine (FOUP, FOSB Auto Packing Machine). Can be customized to put wafer shippers (FOUP, FOSB..etc), Desiccant, Humidity Card, Customer Labels into to customer required bag types (aluminum bag, antistatic bag, transparent bag) and vacuum sealed the packaging. It can save labor costs, reduce safety concerns, improve the quality of wafer packaging, and ensure the airtightness of wafer shippes packaging. Effectively reduces the risk of wafer fragmentation caused by manual operations, and meet the needs of smart production. Label: Attach the customer's label to the bag or FOUP (door housing) Desiccant and HIC card: Place the desiccant and humidity card (HIC) on the FOUP Vacuum heat sealing: vacuum heat sealing after packaging FOUP (can be filled with nitrogen) in bags Folding bag and place tape: fold the bag mouth after heat sealing and fix it with tape.

Applications: Semiconductor wafer packaging, testing and related industries Semiconductor mid-end process equipment . Front-end process: ADI, AEI, ASI….etc. . Advanced Packaging: Wafer Thinning, Bumping process . For wafers: 8"" & 12"" Main functions: Fully automatic wafer inspection (macro & micro) According to customer needs, it can perform macroscopic inspection of wafers such as: wafer corner chipping, cracks, abnormal wafer engraving, residual tin on the edge, etc. Supplemented by AI for defect classification; at the same time, it can perform microscopic inspection of wafers such as critical dimensions, offset, etc. It can replace manual operations, improve the speed and accuracy of wafer inspection, reduce false detection rate, and automatically report, store and analyze data. Meets the needs of smart production. · Fully automated wafer macroscopic inspection/micro inspection measurement · AOI+AI software defect detection and classification

Applications Semiconductor wafer packaging, testing and other related industries Semiconductor mid-end process equipment . For wafers: 8" & 12" Main functions: Laser Grooving Profile Measurement Equipment Measurements can be performed after wafer laser grooving and before Dicing Saw according to customer requirements. The measured wafers include 8" & 12" Contains the following measurement items: . Laser grooving depth measurement . Laser grooving upper edge width measurement . Laser grooving bottom width measurement . Laser grooving offset measurement

CNC pipe bender, Hydraulic Pipe Bending Machine, tube bender with hydraulic tube bending machine, CNC Automatic Tube Bending Machine

The machine is equipped with a powerful functioning CNC controller. The controller employs a windows operation system in combination with the use of Ying Han self-developed CNC control software. Outstanding features include easy generation of bending parameters, 3D workpiece simulation function and single step operational simulation function, etc. These provide users with safe, easy and humanized control features.