Products
  • Products
  • Suppliers
  • News
  • Event
  • Videos
Search
Account
My Profile My Favorite
Log Out
Home Products
add favorite
GoodWay SW-Ⅱ Series Multi-tasking Swiss Turning Centers More Info

SW-Ⅱ Series

Y2-axis
small size
Precision
Swiss Turning
B-axis
Suppliers:

GOODWAY MACHINE CORP.

On the basis of innovative mechanical structure, plentiful tooling system and flexible hybrid guide bush design, SW-II serial can achieve unprecedented rigidity and productivity.
Contact
add favorite
Awea MCP Series Moving Column Bridge Type Multi-face Machining Centers More Info

MCP Series

Heavy
Large
Moving Column
Bridge Type
Suppliers:

AWEA MECHANTRONIC CO., LTD.

Moving Column Bridge Type Multi-face Machining Center, the MCP series, was designed for machining of large work piece as required by aerospace, automotive, and marine industries.
Contact
add favorite
Awea AHM Series High Performance Horizontal Machining Centers More Info

AHM Series

HPC
Heavy-duty Machining
super rigid
APC
Suppliers:

AWEA MECHANTRONIC CO., LTD.

AWEA's new debut, the AHM series, establishes a new benchmark for cost-effective horizontal machining centers.
Contact
add favorite
SHUZ TUNG PCB Hybrid Optical 3D Metrology More Info

SHUZ TUNG PCB Hybrid Optical 3D Metrology

PCB Via inspection
3D inspection
PAD
PCB Trace
Dimple
Roughness inspection
Suppliers:

SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.

PCB 3D topography measurement equipment According to customer needs, the size of surface topography of the PCB board can be measured. Include the following measurement items: Thickness Measurement (Cu) Dimple, Recessed hole depth Trace copper foil (width, space, thickness) Tin pad (diameter, thickness) Via (CD, depth) Surface roughness (Ra,Rz,Rq,Sa,Sz,Sq) Etching (width, space, depth), ..etc.
Contact
add favorite
SHUZ TUNG Wafer Shippers Automatic Packing Machine More Info

SPK(APK)

FOUP/FOSB Auto Packing Machine
Suppliers:

SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.

Applications: Semiconductor wafer manufacturing, packaging, testing and related industries Automated handling and packaging inside/outside the factory Uses: 8"" & 12"" wafer shipment and inter-fab transfer (including Reel/HWS/TRAY packaging and shipping) Applicable wafer shippers: FOUP/FOSB(12""); Reel/Jedec Tray/HWS/POD (8"") Types of packaging bags: aluminum bags, antistatic bags, transparent bags Main functions: FOUP/FOSB Automatic Packaging Machine Wafer shippers automatic packaging machine (FOUP, FOSB Auto Packing Machine). Can be customized to put wafer shippers (FOUP, FOSB..etc), Desiccant, Humidity Card, Customer Labels into to customer required bag types (aluminum bag, antistatic bag, transparent bag) and vacuum sealed the packaging. It can save labor costs, reduce safety concerns, improve the quality of wafer packaging, and ensure the airtightness of wafer shippes packaging. Effectively reduces the risk of wafer fragmentation caused by manual operations, and meet the needs of smart production. Label: Attach the customer's label to the bag or FOUP (door housing) Desiccant and HIC card: Place the desiccant and humidity card (HIC) on the FOUP Vacuum heat sealing: vacuum heat sealing after packaging FOUP (can be filled with nitrogen) in bags Folding bag and place tape: fold the bag mouth after heat sealing and fix it with tape.
Contact
add favorite
SHUZ TUNG Wafer Shippers Automatic Packing Machine More Info

SUP(UPK)

FOUP/FOSB Auto Unpacking Machine
Suppliers:

SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.

Applications: Semiconductor wafer manufacturing, packaging, testing and related industries Automated handling and packaging inside/outside the factory Uses: 8"" & 12"" wafer shipment and inter-fab transfer (including Reel/HWS/TRAY packaging and shipping) Applicable wafer shippers: FOUP/FOSB(12""); Reel/Jedec Tray/HWS/POD (8"") Types of packaging bags: aluminum bags, antistatic bags, transparent bags Main functions: FOUP/FOSB Automatic Packaging Machine Wafer shippers automatic packaging machine (FOUP, FOSB Auto Packing Machine). Can be customized to put wafer shippers (FOUP, FOSB..etc), Desiccant, Humidity Card, Customer Labels into to customer required bag types (aluminum bag, antistatic bag, transparent bag) and vacuum sealed the packaging. It can save labor costs, reduce safety concerns, improve the quality of wafer packaging, and ensure the airtightness of wafer shippes packaging. Effectively reduces the risk of wafer fragmentation caused by manual operations, and meet the needs of smart production. Label: Attach the customer's label to the bag or FOUP (door housing) Desiccant and HIC card: Place the desiccant and humidity card (HIC) on the FOUP Vacuum heat sealing: vacuum heat sealing after packaging FOUP (can be filled with nitrogen) in bags Folding bag and place tape: fold the bag mouth after heat sealing and fix it with tape.
Contact
add favorite
SHUZ TUNG Automatic Wafer Inspection Equipment More Info

WP-MM3200

Critical Dimension Measurement
Wafer Macro Defect Inspection
Wafer Micro Defect Inspection
Suppliers:

SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.

Applications: Semiconductor wafer packaging, testing and related industries Semiconductor mid-end process equipment . Front-end process: ADI, AEI, ASI….etc. . Advanced Packaging: Wafer Thinning, Bumping process . For wafers: 8"" & 12"" Main functions: Fully automatic wafer inspection (macro & micro) According to customer needs, it can perform macroscopic inspection of wafers such as: wafer corner chipping, cracks, abnormal wafer engraving, residual tin on the edge, etc. Supplemented by AI for defect classification; at the same time, it can perform microscopic inspection of wafers such as critical dimensions, offset, etc. It can replace manual operations, improve the speed and accuracy of wafer inspection, reduce false detection rate, and automatically report, store and analyze data. Meets the needs of smart production. · Fully automated wafer macroscopic inspection/micro inspection measurement · AOI+AI software defect detection and classification
Contact
add favorite
SHUZ TUNG Auto Laser Grooving 3D Profile Measurement More Info

LG-3200

Laser Grooving Measurement
Suppliers:

SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.

Applications Semiconductor wafer packaging, testing and other related industries Semiconductor mid-end process equipment . For wafers: 8" & 12" Main functions: Laser Grooving Profile Measurement Equipment Measurements can be performed after wafer laser grooving and before Dicing Saw according to customer requirements. The measured wafers include 8" & 12" Contains the following measurement items: . Laser grooving depth measurement . Laser grooving upper edge width measurement . Laser grooving bottom width measurement . Laser grooving offset measurement
Contact
GOODWAY MACHINE CORP.
GOODWAY MACHINE CORP.

Website: http://www.goodwaycnc.com/

Address: No. 13, Gongyequ 5th Rd., Xiehe Vil., Xitun Dist., Taichung City 40767.

View More
AWEA MECHANTRONIC CO., LTD.
AWEA MECHANTRONIC CO., LTD.

Website: http://www.awea.com

Address: NO.629, SHUEI CHE TOU DUAN, GUANBU RD., SHINPU JEN, HSINCHU

View More
SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.
SHUZ TUNG(WisePioneer) MACHINERY INDUSTRIAL CO., LTD.

Website: http://www.wisepioneer.com.tw/

Address: No. 30, Houke S. Rd., Houli Dist., Taichung City 42152.

View More